How to Choose the Right Intel Processor Generation? OnLogic has plans to support this CPU family with some intriguing products. But don’t sleep on the forthcoming improvements to the Skylake microarchitecture. Where will Intel focus its embedded offerings in its new three-step scheme? That’s a good question, and one that will be important for IPC buyers to keep an eye on.įor now, the real action is on Skylake, where Intel’s most advanced, mature CPU family offers a compelling blend of performance, price and extended support for IPC platforms like the Logic Supply ML100G-50 and the other Rugged and Industrial systems featuring Skylake processors. It offers increased clock speeds, an improved graphics core, and quicker changes when throttling clock speeds.Īnd if you look at Intel’s roadmap going forward, Intel’s upcoming die shrink of the Kaby Lake microarchitecture (a generation that was, until recently, to be known as Cannon Lake) will introduce the 10nm process in the first half of 2018, followed by the architecture step with Icelake and the optimization step with Tigerlake in 2019. As a result, the successor to Skylake is not a “tick” release that reduces transistor size down to 10nm rather it is an optimization of the 14nm Skylake microarchitecture called Kaby Lake. This lifecycle is called “process-architecture-optimization.” This process reflects the need to leverage investments in ever smaller transistor process technology. The challenge of manufacturing chips at extreme densities has prompted Intel to adopt a three-step lifecycle. What Has Changed With Intel’s Processor Tick-Tock Release Schedule? Going back to 2010, there’s a similar dynamic between Westmere and Sandy Bridge and between Ivy Bridge and Haswell generations. So in the current generation there are no embedded-class CPUs within the 14nm Broadwell family (tick), while multiple embedded-class CPUs are offered within Skylake (tock). In its tick-tock scheme, Intel has focused embedded support on the tock side of the cadence. Intel embedded-class CPUs combine low power consumption for fanless operation with long support intervals, making them an optimal fit for Industrial PCs. This is something that’s rarely available with more commonly available consumer and commercial CPUs and chipsets. This matters because IPCs deployments often require assured support extending to five years or beyond. When the Broadwell CPU arrived in September 2014, it was a “tick” release squeezing transistor width down to 14nm and setting the stage for the “tock” release a year later when Skylake arrived. Just over a year later, the Haswell processor improved on the 22nm design by adding a wider core, new instructions and a host of other enhancements. For example: The Ivy Bridge processor in April 2012 introduced the 22 nanometer (nm) manufacturing process. Since 2007, Intel has released CPU architectures under its Tick-Tock model, where the tick is a CPU release that introduces a shrinking of the process technology used to build the chip, and the tock is an enhancement of the microarchitecture to improve performance and functionality. How do you adopt PCs with the right CPU for your embedded applications? These users must make informed decisions about the PCs they deploy, particularly for industrial PCs (IPCs) with stringent lifecycle requirements. But now, Intel’s tick-tock changing approach to processor releases poses a challenge to hardware users. From beefed up integrated graphics, to improved power consumption, CPUs with code names like Skylake, Kaby Lake, and Coffee Lake are raising the bar. Intel constantly rolls out new processors to slide into its Core i3/i5/i7 branding scheme.
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